HMC436MS8G
|
2003 *
|
100
|
5,03
|
26.09.2024 15:45:17
|
|
|
HMC436MS8G
|
2003 *
|
100
|
5,03
|
26.09.2024 15:45:17
|
|
|
TECAP 33/10V C 20 (TCSCS1A336MCAR)
|
б/г SAMSUNG 500
|
|
0,80
|
26.09.2024 15:21:21
|
|
|
TECAP 33/10V C 20 (TCSCS1A336MCAR)
|
б/г SAMSUNG 500
|
351
|
0,80
|
26.09.2024 15:21:21
|
|
|
MCP16301T-I/CHY SOT23-6 Microchip код HT**
|
|
92
|
15,08
|
26.09.2024 15:05:14
|
|
|
MCP1640T-I/CHY SOT23-6 Microchip код BZ**
|
|
36
|
30,16
|
26.09.2024 15:05:14
|
|
|
3,6 Mom (CF 1/4W) ±5% Pезистор выводной (в ленте)
|
Chian-Chia
|
5000
|
0,02
|
26.09.2024 15:04:30
|
|
|
3,6 Mom (CF 0,5W) ±5% Pезистор выводной (в ленте)
|
Chian-Chia
|
2000
|
0,04
|
26.09.2024 15:04:30
|
|
|
шт CENTRONICS\P2,16\36C\каб\кож мет\CENC-36M\CONNF
|
DS1078-36M0L\CONNFLY Разъемы CENTRONICS, TELCO
|
20
|
44,24
|
26.09.2024 14:56:42
|
|
|
шт microCENTRONICS\P1,27\36C\каб\кож пласт\MCR-36M
|
пайка на кабель Разное
|
6
|
60,33
|
26.09.2024 14:56:42
|
|
|
PIC10F220T-I/OT SOT23-6 MCRCH
|
|
95
|
|
26.09.2024 14:46:32
|
|
|
TP4057 (57ba) SOT23-6 MCRCH
|
|
95
|
|
26.09.2024 14:46:32
|
|
|
TECAP 33-10V C 20 (TCSCS1A336MCAR)
|
|
263
|
1,29
|
26.09.2024 14:41:17
|
|
|
HMC436MS8G
|
2003г *
|
100
|
5,33
|
12.01.2024 12:12:29
|
|
|
HMC436MS8G
|
2003г *
|
100
|
5,33
|
12.01.2024 12:12:29
|
|
|
TECAP 33/10V C 20 (TCSCS1A336MCAR)
|
б/г SAMSUNG 500
|
351
|
0,93
|
12.01.2024 12:12:29
|
|
|
MC-36M ВИЛКА
|
|
3
|
|
12.01.2024 12:12:29
|
|
|
TCSCS1A336MCAR 33mkF x 10V C
|
SAMSUNG
|
|
|
06.10.2021 15:13:12
|
|
|
TMCME1C336MTRF (33мкф 16в типD)/ TECAP
|
|
|
|
06.10.2021 15:13:12
|
|
|
TMCSE1A336MTRF (33мкф 10в типD)/ TECAP
|
|
|
|
06.10.2021 15:13:12
|
|
|